Invention Grant
- Patent Title: Metal particle dispersion liquid, method for manufacturing metal particle dispersion liquid, method for manufacturing conductive-film-forming substrate, electronic device and electronic apparatus
- Patent Title (中): 金属颗粒分散液，金属颗粒分散液的制造方法，导电膜形成用基板的制造方法，电子设备及电子设备
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Application No.: US12457484Application Date: 2009-06-12
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Publication No.: US07767115B2Publication Date: 2010-08-03
- Inventor: Masahiro Furusawa , Rumi Shinagawa , Toshimi Fukui , Junko Nakamoto , Kuninori Obata
- Applicant: Masahiro Furusawa , Rumi Shinagawa , Toshimi Fukui , Junko Nakamoto , Kuninori Obata
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-080734 20050318; JP2005-080735 20050318; JP2005-080736 20050318; JP2005-080737 20050318; JP2005-352761 20051206
- Main IPC: H01B1/22
- IPC: H01B1/22
Abstract:
A metal particle dispersion liquid comprises: a compound including a sulfur atom; metal particles whose diameter ranges from 1 to 100 nm and made of a material including a precious metal material; and a dispersion medium. The metal particles is covered by the compound.
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