Invention Grant
- Patent Title: Embossing assembly and methods of preparation
- Patent Title (中): 压花装配及其制备方法
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Application No.: US11498529Application Date: 2006-08-02
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Publication No.: US07767126B2Publication Date: 2010-08-03
- Inventor: Gary Yih-Ming Kang , John Hanan Liu , Yi-Shung Chaug
- Applicant: Gary Yih-Ming Kang , John Hanan Liu , Yi-Shung Chaug
- Applicant Address: US CA Fremont
- Assignee: SiPix Imaging, Inc.
- Current Assignee: SiPix Imaging, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Howrey LLP
- Main IPC: B29C33/38
- IPC: B29C33/38 ; C08J7/00
Abstract:
The invention is directed to an embossing assembly comprising an embossing sleeve having a three-dimensional pattern formed thereon, an expandable insert; and a drum over which said sleeve and said expandable insert are mounted. The present invention is also directed to a method for preparing an embossing drum or an embossing sleeve. The present invention is further directed to a method for controlling the thickness of a plating material over the surface of a drum or sleeve in an electroplating process.
Public/Granted literature
- US20070042129A1 Embossing assembly and methods of preparation Public/Granted day:2007-02-22
Information query
