Invention Grant
- Patent Title: AlRu sputtering target and manufacturing method thereof
- Patent Title (中): AlRu溅射靶及其制造方法
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Application No.: US11733016Application Date: 2007-04-09
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Publication No.: US07767139B2Publication Date: 2010-08-03
- Inventor: Akira Hisano
- Applicant: Akira Hisano
- Applicant Address: JP Tokyo
- Assignee: Nippon Mining & Metals Co., Ltd.
- Current Assignee: Nippon Mining & Metals Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Howson & Howson LLP
- Priority: JP2002-182713 20020624
- Main IPC: B22F1/00
- IPC: B22F1/00 ; B22F1/02

Abstract:
An AlRu sputtering target that is a sintered body composed of an AlRu intermetallic compound of 95 vol. % or more is provided. It is manufactured by a stable and low-cost method that provides it with an even texture, significantly reduces oxygen, prevents or suppresses the generation of particles, and improves the yield ratio of deposition goods.
Public/Granted literature
- US20070175753A1 AlRu Sputtering Target and Manufacturing Method thereof Public/Granted day:2007-08-02
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