Invention Grant
- Patent Title: Pain relief implant pellet and method using same
- Patent Title (中): 疼痛缓解植入物颗粒和使用其的方法
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Application No.: US10381864Application Date: 2001-09-26
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Publication No.: US07767218B2Publication Date: 2010-08-03
- Inventor: Stephen E. Bachman , Michael E. Hubbert
- Applicant: Stephen E. Bachman , Michael E. Hubbert
- Agency: Quarles & Brady LLP
- Agent Dale F. Regelman
- International Application: PCT/US01/42314 WO 20010926
- International Announcement: WO02/26179 WO 20020404
- Main IPC: A61F2/02
- IPC: A61F2/02
Abstract:
An emplantable pellet comprising one or more pain relief agents. A method to relief pain at the injection site of one or more implanted pharmaceutical pellets comprising the step of implanting one or more of Applicant's implantable pellets. A method to adjust the in vivo rate of release of one or more pain relief agents from Applicants' implantable pellets. A method to adjust the rate of systemic delivery of one or more pharmaceutical agents implanted adjacent one or more of Applicants' implantable pellets.
Public/Granted literature
- US20040022832A1 Pain relief implant pellet and method using same Public/Granted day:2004-02-05
Information query
IPC分类:
