Invention Grant
- Patent Title: Polymer particle composition and process for producing the same
- Patent Title (中): 聚合物颗粒组合物及其制备方法
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Application No.: US10542295Application Date: 2004-02-06
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Publication No.: US07767258B2Publication Date: 2010-08-03
- Inventor: Takashi Ueda , Yoshinori Takeda
- Applicant: Takashi Ueda , Yoshinori Takeda
- Applicant Address: JP Osaka
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka
- Agency: Kenyon & Kenyon LLP
- Priority: JP2003-047803 20030225
- International Application: PCT/JP2004/001360 WO 20040206
- International Announcement: WO2004/076538 WO 20040910
- Main IPC: B32B5/16
- IPC: B32B5/16
Abstract:
The molding thermoplastic polymer, which can solve a problem with fine particles in a suspension polymerization process, a problem for a reduction in energy consumption at the time of drying in an emulsion polymerization process, and a problem in compounding procedures for processors. The invention relates to molding thermoplastic polymer particles comprising 100 parts by weight of suspension polymer particles having a glass transition temperature of 60° C. or more and an average particle diameter of 50 to 500 μm produced by suspension polymerization, the said suspension polymer particles being coated with 5 (inclusive) to 22 (exclusive) parts by weight of an emulsion polymer produced by emulsion polymerization.
Public/Granted literature
- US20060246289A1 Polymer particle composition and process for producing the same Public/Granted day:2006-11-02
Information query
