An insulation shield material is provided having improved performance without the need for expensive additives, complex polymer formulations, or specially prepared carbon black. The semiconductive composition used to make the strippable semiconductive insulation shield layer in contact with the outer surface of a wire and cable insulation layer has a base polymer having a weight average molecular weight of not more than 200,000, an adhesion modifying additive system having at least two components and a conductive carbon black. Each of the adhesion modifying additive system components is different from the base polymer. The first component of the adhesion modifying additive system contains a hydrocarbon wax or ethylene vinyl acetate wax and the second component of the adhesion modifying additive system contains an amide wax.