Invention Grant
- Patent Title: Moisture-curable adhesive composition
- Patent Title (中): 水分固化型粘合剂组合物
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Application No.: US11581714Application Date: 2006-10-16
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Publication No.: US07767308B2Publication Date: 2010-08-03
- Inventor: Philip C. Georgeau , Jonathan H. Ballema
- Applicant: Philip C. Georgeau , Jonathan H. Ballema
- Applicant Address: US MI Schoolcraft
- Assignee: Chem Link, Inc.
- Current Assignee: Chem Link, Inc.
- Current Assignee Address: US MI Schoolcraft
- Agency: Price, Heneveld, Cooper, DeWitt & Litton, LLP
- Main IPC: B32B9/04
- IPC: B32B9/04

Abstract:
A moisture-curable adhesive composition that may be formulated to be free of volatile organic compounds, or substantially free of volatile organic compounds which is safe for chronic exposure, resistant to combustion, and provides a high peel strength useful for securing a rubber membrane material to a rigid roof deck includes a polymer having silicon-containing hydrolyzable terminal groups, a phenolic resin, and a non-polymeric silicon-containing hydrolyzable compound, wherein the ratio of the amount of polymer having silicon-containing hydrolyzable terminal groups by weight to the amount of phenolic resin by weight is greater than 2:1.
Public/Granted literature
- US20070088137A1 Moisture-curable adhesive composition Public/Granted day:2007-04-19
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