Invention Grant
US07767379B2 Polymer compound, positive resist composition, and method of forming resist pattern
有权
高分子化合物,正性抗蚀剂组合物和形成抗蚀剂图案的方法
- Patent Title: Polymer compound, positive resist composition, and method of forming resist pattern
- Patent Title (中): 高分子化合物,正性抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US12204460Application Date: 2008-09-04
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Publication No.: US07767379B2Publication Date: 2010-08-03
- Inventor: Takahiro Dazai , Takayoshi Mori , Hiroaki Shimizu , Kyoko Oshita
- Applicant: Takahiro Dazai , Takayoshi Mori , Hiroaki Shimizu , Kyoko Oshita
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2007-233247 20070907
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C08F28/06

Abstract:
There is provided a positive resist composition including a resin component (A) which displays increased solubility in an alkali developing solution under action of acid, and an acid generator component (B) which generates an acid upon exposure, wherein the resin component (A) includes a polymer compound (A1) containing a structural unit (a0) represented by a general formula (a0-1) shown below, and a structural unit (a1) derived from an acrylate ester which has an acid dissociable, dissolution inhibiting group: (in the formula (a0-1), R represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; two of R′ each independently represents a hydrogen atom, a lower alkyl group, or an alkoxy group of 1 to 5 carbon atoms; X represents an alkylene group of 1 to 5 carbon atoms, an oxygen atom, or a sulfur atom.).
Public/Granted literature
- US20090068590A1 POLYMER COMPOUND, POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2009-03-12
Information query
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