A method for fabricating a dual-suspension system for MEMS-based devices includes: etching the geometry of an upper spring system, a lower spring system, and a proof mass into a substrate; applying a protective barrier to cover at least the exposed portions of the first layer of silicon; etching through portions of the protective barrier and handle wafer to define the shapes of the upper spring system, lower spring system, and proof mass; removing the remainder of the protective barrier; and removing the first layer of oxide from the areas in contact with the upper spring system and removing the second layer of oxide from the areas in contact with the lower spring system. Electrical contacts may be created on the substrate. A wafer may be bonded to the support structure on a side of the substrate. A MEMS-based device fabricated from the method is also provided.