Invention Grant
- Patent Title: Location-based bus termination for multi-core/multi-package processor configurations
- Patent Title (中): 基于位置的多核/多包处理器配置的总线终端
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Application No.: US12423142Application Date: 2009-04-14
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Publication No.: US07767492B1Publication Date: 2010-08-03
- Inventor: Darius D. Gaskins , James R. Lundberg
- Applicant: Darius D. Gaskins , James R. Lundberg
- Applicant Address: TW Taipei
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW Taipei
- Agent Richard K. Huffman; James W. Huffman
- Main IPC: H01L21/48
- IPC: H01L21/48

Abstract:
A multi-core/multi-package bus termination apparatus includes a first node, a location array, and a plurality of drivers. The first node receives a signal indicating whether a package upon which the processor core is disposed is internal to the bus or at a far end of the bus. The location array generates location signals indicating locations on the bus of nodes, where the locations are either an internal location or a bus end location. The drivers control how the nodes are driven. Each drivers has location-based multi-core/multi-package logic. The location-based multi-core/multi-package logic enables pull-up logic and first pull-down logic responsive to states of the first node ad the location signals.
Information query
IPC分类: