Invention Grant
- Patent Title: Microelectronic package element and method of fabricating thereof
- Patent Title (中): 微电子封装元件及其制造方法
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Application No.: US11827676Application Date: 2007-07-12
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Publication No.: US07767497B2Publication Date: 2010-08-03
- Inventor: Belgacem Haba
- Applicant: Belgacem Haba
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
Microelectronic package elements and packages having dielectric layers and methods of fabricating such elements packages are disclosed. The elements and packages may advantageously be used in microelectronic assemblies having high routing density.
Public/Granted literature
- US20090014861A1 Microelectronic package element and method of fabricating thereof Public/Granted day:2009-01-15
Information query
IPC分类:
