Invention Grant
- Patent Title: Superjunction device with improved ruggedness
- Patent Title (中): 超强连接装置具有改善的耐用性
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Application No.: US11586901Application Date: 2006-10-26
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Publication No.: US07767500B2Publication Date: 2010-08-03
- Inventor: Srikant Sridevan
- Applicant: Srikant Sridevan
- Applicant Address: SG Singapore
- Assignee: Siliconix Technology C. V.
- Current Assignee: Siliconix Technology C. V.
- Current Assignee Address: SG Singapore
- Main IPC: H01R4/24
- IPC: H01R4/24 ; H01L23/62

Abstract:
An improved superjunction semiconductor device includes a charged balanced pylon in a body region, where a top of the pylon is large to create slight charge imbalance. A MOSgated structure is formed over the top of the pylon and designed to conduct current through the pylon. By increasing a dimension of the top of the pylon, the resulting device is less susceptible to variations in manufacturing tolerances to obtain a good breakdown voltage and improved device ruggedness.
Public/Granted literature
- US20070048909A1 Superjunction device with improved ruggedness Public/Granted day:2007-03-01
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