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US07767510B2 Semiconductor device made by the method of producing hybrid orientnation (100) strained silicon with (110) silicon 有权
通过制造具有（110）硅的杂化取向（100）应变硅的方法制造的半导体器件

  • Patent Title: Semiconductor device made by the method of producing hybrid orientnation (100) strained silicon with (110) silicon
  • Patent Title (中): 通过制造具有（110）硅的杂化取向（100）应变硅的方法制造的半导体器件
  • Application No.: US11760822
    Application Date: 2007-06-11
  • Publication No.: US07767510B2
    Publication Date: 2010-08-03
  • Inventor: Rick L. Wise , Angelo Pinto
  • Applicant: Rick L. Wise , Angelo Pinto
  • Applicant Address: US TX Dallas
  • Assignee: Texas Instruments Incorporated
  • Current Assignee: Texas Instruments Incorporated
  • Current Assignee Address: US TX Dallas
  • Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
  • Main IPC: H01L21/8238
  • IPC: H01L21/8238
Semiconductor device made by the method of producing hybrid orientnation (100) strained silicon with (110) silicon
Abstract:
There is provided a method of manufacturing a semiconductor device. In one aspect, the method includes providing a strained silicon layer having a crystal orientation located over a semiconductor substrate having a different crystal orientation. A mask is placed over a portion of the strained silicon layer to leave an exposed portion of the strained silicon layer. The exposed portion of the strained silicon layer is amorphized and re-crystallized to a crystal structure having an orientation the same as the semiconductor substrate.
Abstract(Chinese):

提供了制造半导体器件的方法。 一方面，该方法包括提供具有位于具有不同晶体取向的半导体衬底之上的晶体取向的应变硅层。 将掩模放置在应变硅层的一部分上以留下应变硅层的暴露部分。 应变硅层的暴露部分非晶化并再结晶成具有与半导体衬底相同的取向的晶体结构。

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IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70 .由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77 ..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78 ...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82 ....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822 .....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232 ......场效应工艺
H01L21/8234 .......MIS工艺
H01L21/8238 ........互补场效应晶体管，例如CMOS
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