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Invention Grant
US07767516B2 Semiconductor device, manufacturing method thereof, and manufacturing method of antenna 有权
半导体装置及其制造方法以及天线的制造方法

Semiconductor device, manufacturing method thereof, and manufacturing method of antenna
Abstract:
An element group having a transistor is formed over a substrate and a conductive film to be a dummy pattern is formed over the element group by pushing out a paste including conductive particles from a first opening portion, and then a conductive film functioning as an antenna is formed continuously thereafter so as to electrically connect with the transistor, by pushing out a paste including conductive particles from a second opening portion. Therefore, an element group having a transistor, provided over a substrate; a first conductive film functioning as an antenna provided over the element group and is electrically connected to the transistor; a second conductive film to be a dummy pattern provided to be adjacent to the first conductive film and is not electrically connected to the transistor; are included.
Abstract(Chinese):

在基板上形成具有晶体管的元件组，并且通过从第一开口部分推出包括导电粒子的浆料，在元件组上形成作为虚设图案的导电膜，然后，用作天线的导电膜为 随后通过从第二开口部分推出包括导电粒子的浆料，从而与晶体管电连接。 因此，设置在基板上的具有晶体管的元件组; 用作天线的第一导电膜，设置在元件组上并电连接到晶体管; 第二导电膜为与第一导电膜相邻且不与晶体管电连接的虚设图案; 包括在内。

Public/Granted literature
Information query
Espacenet
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70 .由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77 ..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78 ...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82 ....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822 .....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232 ......场效应工艺
H01L21/8234 .......MIS工艺
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