Invention Grant
- Patent Title: Semiconductor device with integrated flash memory and peripheral circuit and its manufacture method
- Patent Title (中): 具有集成闪存和外围电路的半导体器件及其制造方法
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Application No.: US12320753Application Date: 2009-02-04
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Publication No.: US07767523B2Publication Date: 2010-08-03
- Inventor: Shinichi Nakagawa
- Applicant: Shinichi Nakagawa
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-100459 20050331
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A non-volatile semiconductor memory device includes: a nonvolatile memory area including gate electrodes, each including stack of a floating gate, an inter-electrode insulating film and a control gate, and having first insulating side walls formed on side walls of the gate electrode; a peripheral circuit area including single-layer gate electrodes made of the same layer as the control gate; and a first border area including: a first isolation region formed in the semiconductor substrate for isolating the non-volatile memory area and peripheral circuit area; a first conductive pattern including a portion made of the same layer as the control gate and formed above the isolation region; and a first redundant insulating side wall made of the same layer as the first insulating side wall and formed on the side wall of the first conductive pattern on the side of the non-volatile memory area.
Public/Granted literature
- US20090191700A1 Semiconductor device with integrated flash memory and peripheral circuit and its manufacture method Public/Granted day:2009-07-30
Information query
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