Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11256093Application Date: 2005-10-24
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Publication No.: US07767535B2Publication Date: 2010-08-03
- Inventor: Kouji Matsuo
- Applicant: Kouji Matsuo
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2002-266759 20020912; JP2003-318143 20030910
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device comprising a semiconductor substrate having a recess whose depth is not more than 6 nm, a source region and a drain region which are formed in a surface region of the semiconductor substrate so as to sandwich the recess, each of the source region and the drain region being constituted of an extension region and a contact junction region, a gate insulating film formed between the source region and the drain region in the semiconductor substrate, and a gate electrode formed on the gate insulating film.
Public/Granted literature
- US20060038241A1 Semiconductor device and method of manufacturing the same Public/Granted day:2006-02-23
Information query
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