Invention Grant
- Patent Title: Semiconductor device and fabricating method thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11025376Application Date: 2004-12-28
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Publication No.: US07767536B2Publication Date: 2010-08-03
- Inventor: Tae Woo Kim
- Applicant: Tae Woo Kim
- Applicant Address: KR Seoul
- Assignee: Dongbu Electronics Co., Ltd.
- Current Assignee: Dongbu Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: The Law Offices of Andrew D. Fortney
- Agent Andrew D. Fortney; Sharon E. Brown Turner
- Priority: KR10-2003-0101818 20031231
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device and fabrication method thereof are disclosed. An example semiconductor device includes a semiconductor substrate having a device isolation area defining an active area; a gate oxide layer formed on the active area of the substrate; a gate on the gate oxide layer; a spacer provided to a sidewall of the gate; and a well region provided within the active area. The well region includes a threshold voltage adjustment doped region, a halo region, a source region, a drain region, an additional doped region, and a channel stop region, the additional doped region provided between the well region and each of the source and drain regions.
Public/Granted literature
- US20050151174A1 Semiconductor device and fabricating method thereof Public/Granted day:2005-07-14
Information query
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