Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor structure including a first dielectric material, removing the first dielectric material from the monitor structure, and after removing the first dielectric material, cutting the substrate along the area between the first die and the second die to separate the first die from the second die.