Conductive ink is printed onto a wafer held on a vertically movable stage by using a squeegee to force the conductive ink through a stencil. The stencil is supported from below by a supporting member adjacent to the periphery of the stage. After the conductive ink has been printed through the stencil, pneumatic pressure is applied to the stencil from above, and the stage is lowered to separate the wafer from the stencil. The supporting member holds the stencil taut while the stage is being lowered, so that the stencil does not warp downward and the printed conductive ink leaves the stencil at substantially the same time at all points on the wafer surface, preventing the premature escape of air and loss of pneumatic pressure.