Invention Grant
US07767596B2 Wafer support pin for preventing slip dislocation during annealing of water and wafer annealing method using the same
有权
用于防止水退火期间的滑脱错位的晶片支撑销和使用其的晶片退火方法
- Patent Title: Wafer support pin for preventing slip dislocation during annealing of water and wafer annealing method using the same
- Patent Title (中): 用于防止水退火期间的滑脱错位的晶片支撑销和使用其的晶片退火方法
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Application No.: US12005415Application Date: 2007-12-26
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Publication No.: US07767596B2Publication Date: 2010-08-03
- Inventor: Kun Kim , Jin-Kyun Hong , Woo-Hyun Seo , Kyoung-Hwan Song
- Applicant: Kun Kim , Jin-Kyun Hong , Woo-Hyun Seo , Kyoung-Hwan Song
- Applicant Address: KR Gumi
- Assignee: Siltron, Inc.
- Current Assignee: Siltron, Inc.
- Current Assignee Address: KR Gumi
- Agency: Greer, Burns & Crain, Ltd
- Priority: KR10-2006-0134791 20061227
- Main IPC: H01L21/26
- IPC: H01L21/26

Abstract:
A wafer support pin has a front end contacted with a wafer such that the front end is flat or rounded. Thus, gravitational stress is minimized during annealing the wafer, thereby minimizing slip dislocation. This wafer support pin is suitably used for annealing of a wafer, particularly high temperature rapid thermal annealing of a large-diameter wafer.
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