Invention Grant
- Patent Title: Key module
- Patent Title (中): 关键模块
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Application No.: US12202408Application Date: 2008-09-01
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Publication No.: US07767922B2Publication Date: 2010-08-03
- Inventor: Yung-Fa Cheng , Kuo-Hsiang Wu
- Applicant: Yung-Fa Cheng , Kuo-Hsiang Wu
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200810301703 20080521
- Main IPC: H01H9/00
- IPC: H01H9/00

Abstract:
An exemplary key module includes a elastic assembly, a light guide plate, and a key cap. The elastic assembly is including a flat plate and a resilient member. The light guide plate is defining at least one through hole for the resilient member to extend through. The light guide plate is disposed above and in parallel to the flat plate. The key cap is resiliently supported by the resilient member. The light guide plate transmits light through at least a portion of the key cap.
Public/Granted literature
- US20090288936A1 KEY MODULE Public/Granted day:2009-11-26
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