Invention Grant
- Patent Title: Electrofusion socket forming system
- Patent Title (中): 电融插座成型系统
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Application No.: US11546574Application Date: 2006-10-12
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Publication No.: US07767938B2Publication Date: 2010-08-03
- Inventor: Karl-Heinz Krah
- Applicant: Karl-Heinz Krah
- Applicant Address: DE Schutzbach
- Assignee: Karl-Heinz Krah GmbH
- Current Assignee: Karl-Heinz Krah GmbH
- Current Assignee Address: DE Schutzbach
- Agency: Roylance, Abrams, Berdo & Goodman, L.L.P.
- Main IPC: H05B3/06
- IPC: H05B3/06 ; F16L13/00

Abstract:
An electrofusion joint assembly includes a meltable member, such as a pipe or fitting, and a heating element secured to the pipe or fitting. The pipe or fitting may be tapered to facilitate receiving another pipe to form an electrofusion weld joint. Fasteners are used to secure the heating element and extend through a meltable zone and into a non-melt zone. Power supplied to the pipe melts the pipe proximal the heating element.
Public/Granted literature
- US20070145736A1 Electrofusion socket forming system Public/Granted day:2007-06-28
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