Invention Grant
- Patent Title: Resist collapse prevention using immersed hardening
- Patent Title (中): 使用浸入式硬化防止塌陷
-
Application No.: US12150955Application Date: 2008-05-01
-
Publication No.: US07767984B2Publication Date: 2010-08-03
- Inventor: Burn-Jeng Lin , Ching-Yu Chang
- Applicant: Burn-Jeng Lin , Ching-Yu Chang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Tung & Associates
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G21K5/02

Abstract:
A method, tool, and machine for hardening a photoresist image while the photoresist image is immersed in a liquid.
Public/Granted literature
- US20080203322A1 Resist collapse prevention using immersed hardening Public/Granted day:2008-08-28
Information query