发明授权
US07767985B2 EUV pellicle and method for fabricating semiconductor dies using same
有权
EUV防护薄膜和使用其制造半导体管芯的方法
- 专利标题: EUV pellicle and method for fabricating semiconductor dies using same
- 专利标题(中): EUV防护薄膜和使用其制造半导体管芯的方法
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申请号: US11646053申请日: 2006-12-26
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公开(公告)号: US07767985B2公开(公告)日: 2010-08-03
- 发明人: Uzodinma Okoroanyanwu , Ryoung-Han Kim
- 申请人: Uzodinma Okoroanyanwu , Ryoung-Han Kim
- 申请人地址: KY Grand Cayman
- 专利权人: GLOBALFOUNDRIES Inc.
- 当前专利权人: GLOBALFOUNDRIES Inc.
- 当前专利权人地址: KY Grand Cayman
- 代理机构: Farjami & Farjami LLP
- 主分类号: G03F1/00
- IPC分类号: G03F1/00
摘要:
According to one exemplary embodiment, an extreme ultraviolet (EUV) pellicle for use with a lithographic mask comprises a carbon nanotube film. The carbon nanotube EUV pellicle can be mounted on the lithographic mask. The carbon nanotube EUV pellicle protects the lithographic mask from contamination by undesirable particles and also prevents the undesirable particles from forming a focused image on the surface of a semiconductor wafer during fabrication; while advantageously, the carbon nanotube pellicle has a high level of EUV light transmittance.
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