Invention Grant
US07768004B2 Semiconductor device including chips with electrically-isolated test elements and its manufacturing method
失效
包括具有电隔离测试元件的芯片的半导体器件及其制造方法
- Patent Title: Semiconductor device including chips with electrically-isolated test elements and its manufacturing method
- Patent Title (中): 包括具有电隔离测试元件的芯片的半导体器件及其制造方法
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Application No.: US11255885Application Date: 2005-10-24
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Publication No.: US07768004B2Publication Date: 2010-08-03
- Inventor: Hideomi Shintaku
- Applicant: Hideomi Shintaku
- Applicant Address: JP Kawasaki, Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kawasaki, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2004-309013 20041025
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
In a semiconductor device including a semiconductor substrate and an electrode pad formed over the semiconductor substrate, at least one of test element is formed in a region of the semiconductor substrate beneath the electrode pad. The test element is electrically isolated from upper conductive layers outside of the region and the electrode pad.
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