Invention Grant
- Patent Title: Light-emitting diode package and method for fabricating the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US12133472Application Date: 2008-06-05
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Publication No.: US07768026B2Publication Date: 2010-08-03
- Inventor: Yuan-Sheng Cheng
- Applicant: Yuan-Sheng Cheng
- Applicant Address: TW Tu-Cheng, Taipei County
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, Taipei County
- Agent Steven M. Reiss
- Priority: CN200710203334 20071221
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An LED package (200) includes a housing (24), an LED array (22), a phosphor layer (262) and a transparent packaging layer (264). The LED array is received in the housing, the phosphor layer is uniformly and homogenously formed on the LED array; and the transparent packaging layer packages the LED array and the phosphor layer in the housing. A method for fabricating the LED package is also provided.
Public/Granted literature
- US20090159911A1 LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-06-25
Information query
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