Invention Grant
- Patent Title: Multilayer dielectric
- Patent Title (中): 多层电介质
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Application No.: US11830533Application Date: 2007-07-30
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Publication No.: US07768080B2Publication Date: 2010-08-03
- Inventor: Gregory S. Herman , Peter Mardilovich , Randy L. Hoffman , Laura Lynn Kramer , Kurt M. Ulmer
- Applicant: Gregory S. Herman , Peter Mardilovich , Randy L. Hoffman , Laura Lynn Kramer , Kurt M. Ulmer
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L29/78
- IPC: H01L29/78
Abstract:
An apparatus and method relating to a first inorganic dielectric layer having a first concentration of defects and a second inorganic dielectric layer in contact with a first layer and having a second lesser concentration of defects are disclosed.
Public/Granted literature
- US20090032890A1 MULTILAYER DIELECTRIC Public/Granted day:2009-02-05
Information query
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