Invention Grant
US07768096B2 System for fabricating semiconductor components with conductive interconnects
有权
用于制造具有导电互连的半导体部件的系统
- Patent Title: System for fabricating semiconductor components with conductive interconnects
- Patent Title (中): 用于制造具有导电互连的半导体部件的系统
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Application No.: US12114761Application Date: 2008-05-03
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Publication No.: US07768096B2Publication Date: 2010-08-03
- Inventor: Alan G. Wood , William M. Hiatt , David R. Hembree
- Applicant: Alan G. Wood , William M. Hiatt , David R. Hembree
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agent Stephen A. Gratton
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/76 ; H01L21/44
Abstract:
A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the substrate contact. The semiconductor component can be used to form module components, underfilled components, stacked components, and image sensor semiconductor components.
Public/Granted literature
- US20080229573A1 System For Fabricating Semiconductor Components With Conductive Interconnects Public/Granted day:2008-09-25
Information query
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