Invention Grant
- Patent Title: Tape distribution substrate having pattern for reducing EMI
- Patent Title (中): 带状分布基板具有降低EMI的图案
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Application No.: US11482139Application Date: 2006-07-07
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Publication No.: US07768103B2Publication Date: 2010-08-03
- Inventor: Young-sang Cho , Hee-seok Lee
- Applicant: Young-sang Cho , Hee-seok Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2005-0062904 20050712
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A tape distribution substrate comprises a plurality of distribution lines formed on a base film. In one embodiment, the distribution lines comprise data lines arranged in data line pairs, wherein each data line pair carries a data signal with two different polarities. The distance between the data lines in each data line pair becomes narrower as the data lines extend away from the base film. In another embodiment, the distribution lines comprise power distribution lines, each having a body portion including several holes, and divided into one or more sub-power distribution lines connected to the base film.
Public/Granted literature
- US20070012774A1 Tape distribution substrate having pattern for reducing EMI Public/Granted day:2007-01-18
Information query
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