Invention Grant
- Patent Title: Pre-molded clip structure
- Patent Title (中): 预成型夹结构
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Application No.: US11626503Application Date: 2007-01-24
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Publication No.: US07768105B2Publication Date: 2010-08-03
- Inventor: Erwin Victor Cruz , Maria Cristina B. Estacio
- Applicant: Erwin Victor Cruz , Maria Cristina B. Estacio
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56

Abstract:
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
Public/Granted literature
- US20080173991A1 PRE-MOLDED CLIP STRUCTURE Public/Granted day:2008-07-24
Information query
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