A semiconductor die package. It includes a substrate having a first surface and a second surface, a first semiconductor die having its front surface facing the first surface of the substrate, a conductive adhesive disposed between the first semiconductor die and the first surface of the substrate, and a second semiconductor die located on the first semiconductor die. The front surface of second semiconductor die faces away from the first semiconductor die, and the back surface faces toward the first semiconductor die. A plurality of conductive structures electrically couple regions at the front surface of the second semiconductor die to conductive regions at the first surface of the substrate.