Invention Grant
US07768131B1 Package structure preventing solder overflow on substrate solder pads
有权
封装结构可防止衬底焊盘上的焊料溢出
- Patent Title: Package structure preventing solder overflow on substrate solder pads
- Patent Title (中): 封装结构可防止衬底焊盘上的焊料溢出
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Application No.: US12493171Application Date: 2009-06-27
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Publication No.: US07768131B1Publication Date: 2010-08-03
- Inventor: Jun-Chung Hsu , Chen-Lin Li
- Applicant: Jun-Chung Hsu , Chen-Lin Li
- Applicant Address: TW Taoyuan
- Assignee: Kinsus Interconnect Technology Corp.
- Current Assignee: Kinsus Interconnect Technology Corp.
- Current Assignee Address: TW Taoyuan
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A package structure preventing solder overflow on substrate solder pads includes a plurality of die pins, a plurality of solders and a plurality of substrate solder pads. The die pins are located under a die. The substrate solder pads are formed on an upper surface of a substrate by copper plating or etching. Each of the substrate solder pads has at least one solder pad connection point. The solders connect the die pins with the corresponding solder pad connection points, respectively. Each of the solder pad connection points has a pair of solder pad ridges or a pair of solder pad grooves. The solder pad ridges and the solder pad grooves filled with the solder or a resin can prevent the solder overflow problem.
Information query
IPC分类:
