Invention Grant
- Patent Title: Sealed-by-resin type semiconductor device
- Patent Title (中): 密封树脂型半导体器件
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Application No.: US11344084Application Date: 2006-02-01
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Publication No.: US07768136B2Publication Date: 2010-08-03
- Inventor: Kazuhiko Fukuta , Kenji Toyosawa
- Applicant: Kazuhiko Fukuta , Kenji Toyosawa
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-027056 20050202
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor device such as a COF or the like is provided on a semiconductor chip on a film-like shaped flexile wiring substrate on which a wiring pattern is formed. Between the semiconductor chip and the flexile wiring substrate, a sealing resin is filled for protecting the semiconductor chip. In the semiconductor device, a resin trace is 0.1 to 1.0 mm in width and 10 μm in thickness, the resin trace being formed when applying the sealing resin along a longitudinal side of the semiconductor chip.
Public/Granted literature
- US20060170085A1 Semiconductor device and manufacturing method thereof Public/Granted day:2006-08-03
Information query
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