Invention Grant
US07768137B2 Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
有权
具有倒装芯片触点的半导体芯片和具有围绕半导体芯片的接触表面的变化的厚度部分的钝化层
- Patent Title: Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
- Patent Title (中): 具有倒装芯片触点的半导体芯片和具有围绕半导体芯片的接触表面的变化的厚度部分的钝化层
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Application No.: US11429433Application Date: 2006-05-08
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Publication No.: US07768137B2Publication Date: 2010-08-03
- Inventor: Gerald Ofner , Ai Min Tan , Mary Teo
- Applicant: Gerald Ofner , Ai Min Tan , Mary Teo
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE10352349 20031106
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/50 ; H01L23/485
Abstract:
A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.
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