Invention Grant
US07768161B2 Method and device for moving an element to be driven using an actuating element formed by etching in a semiconductor material 有权
使用通过在半导体材料中蚀刻形成的致动元件来移动待驱动元件的方法和装置

Method and device for moving an element to be driven using an actuating element formed by etching in a semiconductor material
Abstract:
A device comprising an element to be driven and a driving element designed to be urged into engagement with the element to be driven and an actuating element adapted to generate a reciprocating movement to move the driving element, the driving element and the actuating element being formed by etching in a semiconductor material block, are provided. During a first alternation (a) of the movement generated by the actuating element, the driving element is urged into engagement with the element to be driven to pull the element to be driven. During a second alternation (b) in the opposite direction generated by the actuating element, the driving element slides on the element to be driven, such that the element to be driven is displaced in a step-by-step movement by the driving element.
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