Invention Grant
- Patent Title: Electronic device testing apparatus and temperature control method in an electronic device testing apparatus
- Patent Title (中): 电子设备测试装置中的电子设备测试装置和温度控制方法
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Application No.: US11990435Application Date: 2005-08-25
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Publication No.: US07768286B2Publication Date: 2010-08-03
- Inventor: Shigeru Hosoda , Masaaki Ogawa
- Applicant: Shigeru Hosoda , Masaaki Ogawa
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- International Application: PCT/JP2005/015481 WO 20050825
- International Announcement: WO2007/023557 WO 20070301
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
An electronic device testing apparatus is described that includes a temperature measurement device for measuring a temperature of an IC device based on a voltage of a thermal diode provided inside the IC device, a temperature sensor and a temperature applying device provided to a pusher, and a temperature control portion for calculating a correction value from a difference of a measurement temperature of a predetermined IC device by the temperature measurement device and that by the temperature sensor. A temperature of the IC device to be tested is measured by the temperature measurement device at an actual operation, and the temperature applying device is controlled based on the obtained measurement temperature and the correction value calculated by the temperature control portion.
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