Invention Grant
- Patent Title: Testing method and testing device for an integrated circuit
- Patent Title (中): 一种集成电路的测试方法和测试装置
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Application No.: US11821291Application Date: 2007-06-21
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Publication No.: US07768289B2Publication Date: 2010-08-03
- Inventor: Andreas Hellebrand , Karl-Wilhelm Hoesch
- Applicant: Andreas Hellebrand , Karl-Wilhelm Hoesch
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102006028414 20060621
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
A testing method for an integrated circuit which has at least one ground terminal and multiple signal terminals, a signal potential being applied to a signal terminal and a ground potential being applied to the at least one ground terminal. A floating potential is applied to each further signal terminal. The testing method is suitable to detect more defects than a standard testing method of the Automotive Electronics Council.
Public/Granted literature
- US20080007269A1 Testing method and testing device for an integrated circuit Public/Granted day:2008-01-10
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