Invention Grant
- Patent Title: Multi-drop bus system
- Patent Title (中): 多点总线系统
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Application No.: US12012511Application Date: 2008-01-31
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Publication No.: US07768297B2Publication Date: 2010-08-03
- Inventor: John Wilson
- Applicant: John Wilson
- Applicant Address: US CA Los Altos
- Assignee: Rambus, Inc.
- Current Assignee: Rambus, Inc.
- Current Assignee Address: US CA Los Altos
- Agency: Lerner, David, Littenberg,Krumholz & Mentlik, LLP
- Main IPC: H03K17/16
- IPC: H03K17/16

Abstract:
A multi-drop bus system and a method for operating such a system. The system includes a multi-drop bus having at least one bus line, each bus line being made up of a multiple of line segments. Each of the line segments terminates at a drop point and each drop point is coupled to a load impedance. The characteristic impedance of a line segment is matched to the equivalent impedance presented by the load impedance in combination with the characteristic impedance of a following segment, or is matched to the load impedance if there is no following segment.
Public/Granted literature
- US20090037626A1 Multi-drop bus system Public/Granted day:2009-02-05
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