Invention Grant
- Patent Title: Method and apparatus for mounting a circuit board to a transformer
- Patent Title (中): 将电路板安装到变压器的方法和装置
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Application No.: US11846921Application Date: 2007-08-29
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Publication No.: US07768370B2Publication Date: 2010-08-03
- Inventor: Michael J. Brown
- Applicant: Michael J. Brown
- Applicant Address: CA Guelph, Ontario
- Assignee: Hammond Power Solutions, Inc.
- Current Assignee: Hammond Power Solutions, Inc.
- Current Assignee Address: CA Guelph, Ontario
- Agency: Quarles & Brady LLP
- Agent George E. Haas
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F5/00 ; H01F27/28 ; H01F17/04
Abstract:
An electromagnetic assembly which has a base, at least one winding, and a magnetic core connected to the base, where at least one winding is mounted on the magnetic core. A housing part encloses at least part of at least one winding, and a printed circuit board is mounted to the housing part. The electromagnetic assembly can be a transformer or inductor, for example.
Public/Granted literature
- US20090058586A1 METHOD AND APPARATUS FOR MOUNTING A CIRCUIT BOARD TO A TRANSFORMER Public/Granted day:2009-03-05
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