Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11007257Application Date: 2004-12-09
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Publication No.: US07768405B2Publication Date: 2010-08-03
- Inventor: Shunpei Yamazaki , Jun Koyama , Mai Akiba
- Applicant: Shunpei Yamazaki , Jun Koyama , Mai Akiba
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2003-414848 20031212; JP2004-009529 20040116
- Main IPC: G08B13/14
- IPC: G08B13/14

Abstract:
A semiconductor device typified by a wireless tag, which has improved mechanical strength, can be formed by a more simple process at a low cost and prevent radio waves from being shielded, and a manufacturing method of the semiconductor device. According to the invention, a wireless tag includes a thin film integrated circuit formed of an isolated TFT having a thin film semiconductor film. The wireless tag may be attached directly to an object, or attached to a flexible support such as plastic and paper before being attached to an object. The wireless tag of the invention may include an antenna as well as the thin film integrated circuit. The antenna allows to communicate signals between a reader/writer and the thin film integrated circuit, and to supply a power source voltage from the reader/writer to the thin film integrated circuit.
Public/Granted literature
- US20050130389A1 Semiconductor device and manufacturing method thereof Public/Granted day:2005-06-16
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