Invention Grant
- Patent Title: Antenna device and radio communication device
- Patent Title (中): 天线设备和无线电通信设备
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Application No.: US12004480Application Date: 2007-12-21
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Publication No.: US07768456B2Publication Date: 2010-08-03
- Inventor: Yukako Tsutsumi , Mitsuyoshi Endo , Mitsuhiro Nakao
- Applicant: Yukako Tsutsumi , Mitsuyoshi Endo , Mitsuhiro Nakao
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye, PC
- Priority: JP2006-352858 20061227
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
First and second wires are formed so that the further away from a semiconductor chip, the greater the distance between the first and second wires. This prevents currents flowing through the first and second wires from cancelling out each other, and further enables a metallic plate to be disposed as far away from the semiconductor chip as possible. In addition, configuring the metallic plate to have a constant width that is wider than the diameters of the first and second wires results in a wide connection range, thereby ensuring connection even when mounting misalignments occur between the wires and the metallic plate.
Public/Granted literature
- US20080231518A1 Antenna device and radio communication device Public/Granted day:2008-09-25
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