Invention Grant
- Patent Title: Antenna assembly, printed wiring board and device
- Patent Title (中): 天线组件,印刷线路板和设备
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Application No.: US12104208Application Date: 2008-04-16
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Publication No.: US07768463B2Publication Date: 2010-08-03
- Inventor: Zhinong Ying , Ishimiya Katsunori
- Applicant: Zhinong Ying , Ishimiya Katsunori
- Applicant Address: SE Lund
- Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee Address: SE Lund
- Agency: Harrity & Harrity, LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/38

Abstract:
Antenna assembly may include a dielectric substrate having a relative dielectric constant (∈r) of greater than one. The dielectric substrate may include a first branch that comprises a first antenna pattern and a first ground point for connecting the first antenna pattern to a first ground. The dielectric substrate may include a second branch that may include a second antenna pattern and a second ground point for connecting the second antenna pattern to a second ground. Each antenna pattern may thereby be configured to transmit and/or receive signals within a predetermined frequency band when said antenna assembly is in use.
Public/Granted literature
- US20090262023A1 ANTENNA ASSEMBLY, PRINTED WIRING BOARD AND DEVICE Public/Granted day:2009-10-22
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