Invention Grant
US07768541B2 Heating resistor element, manufacturing method for the same, thermal head, and printer
有权
加热电阻元件,制造方法相同,热敏头和打印机
- Patent Title: Heating resistor element, manufacturing method for the same, thermal head, and printer
- Patent Title (中): 加热电阻元件,制造方法相同,热敏头和打印机
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Application No.: US12254504Application Date: 2008-10-20
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Publication No.: US07768541B2Publication Date: 2010-08-03
- Inventor: Keitaro Koroishi , Toshimitsu Morooka , Noriyoshi Shoji , Yoshinori Sato , Norimitsu Sanbongi
- Applicant: Keitaro Koroishi , Toshimitsu Morooka , Noriyoshi Shoji , Yoshinori Sato , Norimitsu Sanbongi
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2007-275593 20071023; JP2008-218635 20080827
- Main IPC: B41J2/335
- IPC: B41J2/335

Abstract:
Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.
Public/Granted literature
- US20090102911A1 HEATING RESISTOR ELEMENT, MANUFACTURING METHOD FOR THE SAME, THERMAL HEAD, AND PRINTER Public/Granted day:2009-04-23
Information query
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