Opening portions (opening patterns) having different arrangement pitches and sizes are formed in first metal film patterns, a first semiconductor film, second metal film patterns, a third insulating film, and the like under a reflective electrode, respectively. These opening portions overlap each other complexly to form fine bumps and dips in the surface of the reflective electrode. Further, the opening portions can be formed in the first metal film patterns, the first semiconductor film, and the second metal film patterns simultaneously with the formation of TFTs. Accordingly, an increase in the number of steps can be avoided.