Invention Grant
- Patent Title: Method for manufacturing a semiconductor device
- Patent Title (中): 半导体器件的制造方法
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Application No.: US11823095Application Date: 2007-06-26
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Publication No.: US07768617B2Publication Date: 2010-08-03
- Inventor: Shunpei Yamazaki , Hironobu Shoji , Ikuko Kawamata
- Applicant: Shunpei Yamazaki , Hironobu Shoji , Ikuko Kawamata
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell Sanders LLP
- Priority: JP2006-184719 20060704
- Main IPC: G02F1/1343
- IPC: G02F1/1343 ; B05D5/00 ; B05D1/32 ; B05D7/22

Abstract:
When a conductive layer is formed, a first liquid composition containing a conductive material is applied on an outer side of a pattern that is desired to be formed (corresponding to a contour or an edge portion of a pattern), and a first conductive layer (insulating layer) having a frame-shape is formed. A second liquid composition containing a conductive material is applied so as to fill a space inside the first conductive layer having a frame-shape, whereby a second conductive layer is formed. The first conductive layer and the second conductive layer are formed so as to be in contact with each other, and the first conductive layer is formed so as to surround the second conductive layer. Therefore, the first conductive layer and the second conductive layer can be used as one continuous conductive layer.
Public/Granted literature
- US20080042288A1 Method for manufacturing display device Public/Granted day:2008-02-21
Information query
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