Invention Grant
US07768619B2 Method and apparatus for sealing flex circuits made with an LCP substrate
有权
用于密封由LCP基片制成的柔性电路的方法和装置
- Patent Title: Method and apparatus for sealing flex circuits made with an LCP substrate
- Patent Title (中): 用于密封由LCP基片制成的柔性电路的方法和装置
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Application No.: US10910715Application Date: 2004-08-03
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Publication No.: US07768619B2Publication Date: 2010-08-03
- Inventor: C. W. Sinjin Smith , Charles M. Newton , Paul B. Jaynes
- Applicant: C. W. Sinjin Smith , Charles M. Newton , Paul B. Jaynes
- Applicant Address: US FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: US FL Melbourne
- Agency: GrayRobinson, P.A.
- Main IPC: G02F1/13
- IPC: G02F1/13
Abstract:
A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.
Public/Granted literature
- US20060028612A1 Method and apparatus for sealing flex circuits made with an LCP substrate Public/Granted day:2006-02-09
Information query
