Invention Grant
- Patent Title: Apparatus and method for inspecting defects
- Patent Title (中): 用于检查缺陷的装置和方法
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Application No.: US12328357Application Date: 2008-12-04
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Publication No.: US07768635B2Publication Date: 2010-08-03
- Inventor: Hiroyuki Nakano , Akira Hamamatsu , Sachio Uto , Yoshimasa Oshima , Hidetoshi Nishiyama , Yuta Urano , Shunji Maeda
- Applicant: Hiroyuki Nakano , Akira Hamamatsu , Sachio Uto , Yoshimasa Oshima , Hidetoshi Nishiyama , Yuta Urano , Shunji Maeda
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-013285 20060123
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
A defect inspection apparatus includes a movable stage for mounting a substrate having circuit patterns as an object of inspection, an irradiation optical system which irradiates a slit-shaped light beam from an oblique direction to the circuit patterns of the substrate, a detection optical system which includes an image sensor for receiving reflected/scattered light from the substrate by irradiation of the slit-shaped light beam and converting the received light into a signal, and an image processor which processes the signal. The irradiation optical system includes a cylindrical lens and a coherency reduction optical system, which receives the light beam and emits a plurality of slit-shaped light sub-beams which are spatially reduced in coherency in a light-converging direction of the cylindrical lens. The cylindrical lens focuses the plurality of slit-shaped light sub-beams into the slit-shaped light beam irradiated to the surface of the substrate.
Public/Granted literature
- US20090122303A1 Apparatus And Method For Inspecting Defects Public/Granted day:2009-05-14
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