Invention Grant
- Patent Title: Substrate support having heat transfer system
- Patent Title (中): 具有传热系统的基板支架
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Application No.: US11683994Application Date: 2007-03-08
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Publication No.: US07768765B2Publication Date: 2010-08-03
- Inventor: Andrew Nguyen , Wing Lau Cheng , Hiroji Hanawa , Semyon L. Kats , Kartik Ramaswamy , Yan Ye , Kwok Manus Wong , Daniel J. Hoffman , Tetsuya Ishikawa , Brian C. Lue
- Applicant: Andrew Nguyen , Wing Lau Cheng , Hiroji Hanawa , Semyon L. Kats , Kartik Ramaswamy , Yan Ye , Kwok Manus Wong , Daniel J. Hoffman , Tetsuya Ishikawa , Brian C. Lue
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Janah & Associates, P.C.
- Main IPC: H01T23/00
- IPC: H01T23/00

Abstract:
A support for a substrate processing chamber comprises a fluid circulating reservoir comprising a channel having serpentine convolutions. A fluid inlet supplies a heat transfer fluid to the fluid circulating reservoir and a fluid outlet discharges the heat transfer fluid. In one version, the channel is doubled over to turn back upon itself.
Public/Granted literature
- US20070165356A1 SUBSTRATE SUPPORT HAVING HEAT TRANSFER SYSTEM Public/Granted day:2007-07-19
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