Invention Grant
US07768770B2 Connecting structure between electrode and lead, electric double layer capacitor having the same, and method for manufacturing the capacitor 有权
电极和引线之间的连接结构,具有相同的双电层电容器,以及制造电容器的方法

  • Patent Title: Connecting structure between electrode and lead, electric double layer capacitor having the same, and method for manufacturing the capacitor
  • Patent Title (中): 电极和引线之间的连接结构,具有相同的双电层电容器,以及制造电容器的方法
  • Application No.: US11704662
    Application Date: 2007-02-09
  • Publication No.: US07768770B2
    Publication Date: 2010-08-03
  • Inventor: Jin-A KangHee-Young Lee
  • Applicant: Jin-A KangHee-Young Lee
  • Applicant Address: KR Anyang
  • Assignee: LS Mtron Ltd.
  • Current Assignee: LS Mtron Ltd.
  • Current Assignee Address: KR Anyang
  • Agency: Jones Day
  • Priority: KR10-2006-0014204 20060214
  • Main IPC: H01G9/00
  • IPC: H01G9/00
Connecting structure between electrode and lead, electric double layer capacitor having the same, and method for manufacturing the capacitor
Abstract:
A connecting structure of a lead wire is electrically connected to an electrode in which a polarized electrode layer is formed on a surface of a current collector plate. A region of the electrode, to which the lead wire is to be joined, is free from the polarized electrode layer. The lead wire is joined to the current collector plate by means of stitching and then compressed thereto. This connecting structure may keep a capacitance of a capacitor and improve contact reliability. An electric double layer capacitor having the structure and a method for manufacturing the capacitor are also provided.
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