Invention Grant
- Patent Title: Electronic package with direct cooling of active electronic components
- Patent Title (中): 电子封装，直接冷却有源电子元器件
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Application No.: US12246969Application Date: 2008-10-07
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Publication No.: US07768777B2Publication Date: 2010-08-03
- Inventor: Charles A. Miller
- Applicant: Charles A. Miller
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic components of the dies.
Public/Granted literature
- US20090032938A1 Electronic Package With Direct Cooling Of Active Electronic Components Public/Granted day:2009-02-05
Information query
